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G6 Epoxy

G6E-HRBN Thermally Conductive Epoxy, High Operation Temperature, Room Temperature Curing

G6E-HRBN Thermally Conductive Epoxy, High Operation Temperature, Room Temperature Curing

Regular price $55.00
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Our G6E-HRBN® Epoxy has been specifically formulated adhesives that not only bond materials together but also facilitate the transfer of heat. These epoxies are especially valuable in applications where heat dissipation or thermal management is critical.
G6E-HRBN cures at room temperature which eliminates the necessity for a heating oven, but still maintains a high operating temperature. To achieve this, the G6E-HRBN® Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-HRBN® Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.

FEATURES:

Room Temperature Curing: is suitable for applications where heating may not be feasible or where components may be sensitive to high temperatures.
Strong Electrical Resistance: Strong electrical resistance is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly.
Temperature Resistance: High-temperature epoxy is designed to resist temperature up to 250 C (500F) 
High Thermal Conductivity: Our adhesive ensures efficient heat transfer from the heat-generating component to the heat sink or other thermal management components. It helps in dissipating heat quickly, preventing thermal issues like overheating and
performance degradation.
Durability: A thermal conductive adhesive with excellent mechanical properties can withstand thermal expansions, mechanical stresses, and environmental conditions without compromising the bond's integrity.
Chemical Resistance: resists chemicals, oils, and moisture, ensuring long-term performance in various environments.

APPLICATIONS:

Electronic Assembly: helps in transferring heat away from sensitive electronic components, ensuring proper thermal management and preventing overheating.
Thermal Interface Materials (TIMs): filling of microscopic gaps and imperfections in the interface, ensuring better contact and improved heat dissipation.
Solar panels: helps in enhancing the overall efficiency and reliability of solar panels.
Aerospace and Aviation: managing heat dissipation and ensuring reliable operation in demanding environments.
Automotive Applications: in bonding electronic control units (ECUs), power modules, and other heat-generating components to heat sinks or chassis, ensuring effective heat transfer and thermal stability.
LED Lighting: ensuring proper thermal management and preventing degradation of LED performance due to excessive heat.
Medical Devices: bonding of heat sinks or thermal management components to these devices, aiding in heat dissipation and maintaining stable performance.

SPECIFICATIONS OF UNCURED MATERIAL:

TWO COMPONENT SYSTEM: Part A – smooth gray paste, Part B – light brown liquid
MIX RATIO: 10 (Part A) to 1 (Part B) by weight.
WORKING TIME: 20-30 min
DENSITY: PART A: 1.4-1.5 g/cm^3, PART B: 0.9-1.1g/cm^3
CURING SCHEDULE: 8-10 hours @ 25°C / 77°F, 30 minutes @ 60°C /140°F, 10 minutes @ 150°C / 302°F
MIXED VISCOSITY: 100 -130 Pa·s @ 25°C / 77°F

SPECIFICATIONS OF CURED MATERIAL:

THERMAL CONDUCTIVITY: 1.2 W/m·K
ELECTRICAL RESISTIVITY: > 1X10^9 Ω·cm
GLASS TRANSITION TEMPERATURE (Tg): 140°C / 300°F
FLEXURAL MODULUS: 8-9 GPa at 25°C
LOSS MODULUS: 280- 380 MPa at 25°C
HARDNESS, SHORE: >80D

STORAGE & SHELF LIFE: 6 months at 25°C/77°F in unopened, unmixed containers. Stores and ships at room temperature. No freezing or dry ice required

MIXING INSTRUCTIONS: Add Part B to Part A in a separate container and mix slowly until uniform. Vacuum degassing is recommended.

SAFETY & HANDLING: Always read the SDS for both Part A and Part B before use.  Use the product with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove it from the skin.

PACKAGING: Part A and Part B (packaged in individual jars). Product can be also packaged in various sizes and units to accommodate customer's requirements.

Downloads:

SDS G6E-HRBN

TDS G6E-HRBN

 

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